Altera Device Part Number Format
Select an Altera® device name to see its associated part number format (described in Tables 1, 2, and 3).
| Table 1. Altera Part Number Prefixes |
| Part Number Prefix |
Device Family |
| EP1K |
ACEX |
| EP20K (see Table 2 for EP20KxxxC1) (1) |
APEX 20K |
| EPC |
Configuration |
| EPF |
FLEX |
| EPM |
MAX |
| EPxxx (1) |
Classic |
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| Part Number Example for Table 1 |
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| Table 2. Altera Part Number Prefixes |
| Part Number Prefix |
Device Family |
| EP1C |
Cyclone |
| EP1M |
Mercury |
| EP1S |
Stratix |
| EP1SGX |
Stratix GX |
| EP20KxxxC (1) |
APEX 20KC |
| EP2A |
APEX II |
| EP2C |
Cyclone II |
| EP2S |
Stratix II |
| EP2SGX |
Stratix II GX (Transceiver-Based) |
| EP3C |
Cyclone III |
| EP3SL |
Stratix III L (Logic Enhanced) |
| EP3SE |
Stratix III E (DSP/Memory Enhanced) |
| EP4SE (2) |
Stratix IV E (Enhanced) |
| EP4SGX (2) |
Stratix IV GX (Transceiver-Based) |
| EPM |
MAX II
MAX IIG (Lower Power)
MAX IIZ (Zero Power) |
| EPXA |
Excalibur |
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| Part Number Example for Table 2 |
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| Package Sizes and Pin Counts for EP4SE and EP4SGX Devices |
| Package Size |
Pin Count |
| F29 |
F780 |
| F35 |
F1152 |
| F40 |
F1517 |
| F43 |
F1760 |
| F45 |
F1932 |
| H29 |
H780 |
| H35 |
H1152 |
|
Note:
- xxx = Any three numbers
- EP4SE and EP4SGX devices use package sizes in place of pin counts
| Table 3. Altera HardCopy Series Part Number Prefixes |
| Part Number Prefix |
Device Family |
| HC4GXxyz (1) |
HardCopy IV GX |
| HC4Exyz (1) |
HardCopy IV E |
| HC3xyz (1) |
HardCopy III |
| HC2 |
HardCopy II |
| HC1S |
HardCopy Stratix |
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Note:
- x = logic density
y = I/O count
z = package type (W, L, or F; where W = wire bond, L = cost-optimized flip chip, and F = performance-optimized flip chip)
| Part Number Examples for Table 3 |
| Part Number |
|
HC4GX61F |
|
|
F |
1152 |
| Device |
HardCopy IV GX 61 in a performance-optimized flip chip package |
|
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| Package |
FineLine BGA package |
| Pin Count |
1152 pins |
| Part Number |
|
HC362F |
|
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F |
1152 |
| Device |
HardCopy III 362 in a performance-optimized flip chip package |
|
|
| Package |
FineLine BGA package |
| Pin Count |
1152 pins |
| Part Number |
|
HC362L |
|
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F |
1152 |
| Device |
HardCopy III 362 in cost-optimized flip chip package |
|
|
| Package |
FineLine BGA package |
| Pin Count |
1152 pins |
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Device Codes
To find out which devices are available in a particular device family, or to find out more about a particular device, check the specific device's data sheet.
Package Codes
Package codes are the same in all part number formats (see Table 4).
| Table 4. Package Codes |
| Code |
Package Type |
| B |
Ball-grid array |
BGA |
| D |
Ceramic dual in-line package |
CerDIP |
| E |
Plastic enhanced quad flat pack |
EQFP |
| F |
FineLine BGA package |
FBGA |
| G |
Ceramic pin-grid array |
PGA |
| H |
Hybrid FineLine BGA package |
HBGA |
| L |
Plastic J-lead chip carrier |
PLCC |
| M |
Micro FineLine BGA package |
MBGA |
| P |
Plastic dual in-line package |
PDIP |
| Q |
Plastic quad flat pack |
PQFP |
| R |
Power quad flat pack |
RQFP |
| S |
Small outline integrated circuit |
SOIC |
| T |
Thin quad flat pack |
TQFP |
| U |
Ultra FineLine BGA package |
UFBGA |
Pin count codes are the same in all part number formats. The number in the pin count code indicates the number of pins on the device. One exception is the pin count code 33. This is for devices in a 1,020-pin FineLine BGA package (33 mm on a side).
Temperature Codes
Temperature codes are the same for all part number formats (see Table 5).
| Table 5. Temperature Codes |
| Code |
Explanation |
| C |
Commercial temperature range (0 to 85°C) |
| I |
Industrial temperature range (-40 to 100°C) |
| A |
Automotive temperature range (-40 to 125°C) |
Speed Grades
Altera MAX and Classic devices use the speed grade to indicate the delay in nanoseconds (ns) through a macrocell in the device. For example, a MAX device with a -10 speed grade has a delay of 10 ns through a macrocell. Devices with low speed grade numbers run faster than devices with high speed grade numbers.
Altera Stratix series, Cyclone series, MAX II, MAX IIG, MAX IIZ, FLEX, ACEX, APEX, Mercury, and Excalibur devices use the speed grade to indicate the relative performance of the device. Devices with low speed grade numbers run faster than devices with high speed grade numbers. For example, a Stratix III device with a 3 speed grade is the fastest available Stratix III device.
Suffixes
Suffixes are optional letters at the end of a part number that specify certain device features. Not all suffixes are available with all part numbers (see Table 6).
| Table 6. Suffix Codes |
| Code |
Explanation |
| A |
Aluminum process |
| C |
Device shipped in a carrier |
| DX |
FLEX EPF10K100 devices with PLLs |
| ES |
Engineering sample |
| F |
Fixed programming algorithm (for use with in-circuit testers) |
| H |
Special dry-packing shipment option for MAX 7000 devices |
| L |
Stratix III: 0.9V core voltage |
| N |
Lead-free |
| P |
Special PCI-compliant MAX devices |
| T |
Classic devices: Permanently set in turbo (high-speed) mode |
| MAX 7000 devices: Special timing parameters (see data sheet for details) |
| V |
5.0-V tolerant inputs |
| X |
PLLs in APEX and FLEX 10KE devices |
| Z |
Low-power FLASHLOGIC devices (discontinued) |
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