| Table 1: Thermal Resistance of APEX II Devices | |||||||
| Device | Pin Count | Package | qJC (C/W) |
qJA (C/W)Still Air | qJA (C/W)100 ft./min. | qJA (C/W)200 ft./min. | qJA (C/W)400 ft./min. |
|---|---|---|---|---|---|---|---|
| EP2A15 | 672 | Flip Chip FineLine® BGA (FBGA) (Cu lid) |
0.22 |
10.8 |
8.8 |
7.4 |
6.2 |
| Flip Chip FBGA (AlSiC lid) |
0.34 |
11.6 |
9.6 |
8.0 |
6.6 |
||
|
724 |
Flip Chip BGA (Cu lid) |
0.23 |
9.7 |
7.7 |
6.4 |
5.3 |
|
|
Flip Chip BGA (AlSiC lid) |
0.35 |
10.0 |
8.2 |
6.6 |
5.4 |
||
| EP2A25 |
672 |
FBGA (Cu lid) |
0.17 |
10.7 |
8.7 |
7.2 |
6.1 |
| Flip Chip FBGA (AlSiC lid) |
0.26 |
11.5 |
9.6 |
8.0 |
6.6 |
||
|
724 |
Flip Chip BGA (Cu lid) |
0.17 |
9.6 |
7.6 |
6.2 |
5.2 |
|
|
Flip Chip BGA (AlSiC lid) |
0.27 |
10.0 |
8.2 |
6.6 |
5.4 |
||
| 1,020 | Flip Chip FBGA (Cu lid) |
0.17 |
9.8 |
7.8 |
6.4 |
5.3 |
|
| Flip Chip FBGA (AlSiC lid) |
0.27 |
10.4 |
8.5 |
6.9 |
5.7 |
||
| EP2A40 |
672 |
Flip Chip FBGA (Cu lid) |
0.24 |
10.0 |
8.2 |
6.9 |
5.9 |
| Flip Chip FBGA (AlSiC lid) |
0.2 |
10.0 |
8.2 |
6.9 |
5.9 |
||
| 724 |
Flip Chip BGA (Cu lid) |
0.15 |
9.5 |
7.5 |
6.1 |
5.1 |
|
|
Flip Chip BGA (AlSiC lid) |
0.19 |
9.5 |
7.5 |
6.1 |
5.1 |
||
| 1,020 |
Flip Chip FBGA (Cu lid) |
0.15 |
9.7 |
7.7 |
6.3 |
5.2 |
|
|
Flip Chip FBGA (AlSiC lid) |
0.19 |
9.7 |
7.7 |
6.3 |
5.2 |
||
| EP2A70 | 724 |
Flip Chip BGA (Cu lid) |
0.1 |
9.3 |
7.3 |
6.0 |
4.9 |
|
Flip Chip BGA (AlSiC lid) |
0.14 |
10.0 |
7.9 |
6.4 |
5.3 |
||
| 1,508 |
Flip Chip FBGA (Cu lid) |
0.1 |
8.8 |
6.8 |
5.5 |
4.5 |
|
|
Flip Chip FBGA (AlSiC lid) |
0.14 |
9.3 |
7.3 |
5.8 |
4.7 |
||
Thermal Resistance of APEX II Devices
Table 1 provides qJA (junction-to-ambient thermal resistance) and qJC (junction-to-case thermal resistance) values for Altera® APEX® II devices.
