The following table provides 
JA(junction-to-ambient thermal resistance) and JC(junction-to-case thermal resistance) values for configuration device devices.
| Table 1. Thermal Resistance of Configuration Devices | ||||
| Device | Pin Count | Package | qJC (C/W) |
qJA (C/W) |
|---|---|---|---|---|
| EPC1064 EPC1064V |
8 | PDIP (1) |
19.0 |
48.0 |
| 20 | PLCC (2) |
18.0 |
80.0 |
|
| 32 | TQFP (3) |
17.0 |
75.0 |
|
| EPC1213 | 8 | PDIP |
19.0 |
48.0 |
| 20 | PLCC |
18.0 |
80.0 |
|
| 32 | TQFP |
17.0 |
75.0 |
|
| EPC1441 | 8 | PDIP |
19.0 |
48.0 |
| 20 | PLCC |
18.0 |
80.0 |
|
| 32 | TQFP |
17.0 |
75.0 |
|
| EPC1 | 8 | PDIP |
16.0 |
70.0 |
| 20 | PLCC |
18.0 |
80.0 |
|
| EPC2 | 20 | PLCC |
18.0 |
80.0 |
| 32 | TQFP | 17.0 | 75.0 | |
| EPC4 | 44 | PLCC | 9.0 | 52.0 |
| 144 | FineLine BGA | 17.0 | 75.0 | |
| EPC8 | 100 | PQFP (4) | (5) | (5) |
| EPC16 | 88 | Ultra FineLine BGA | (5) | (5) |
| 100 | PQFP | (5) | (5) | |
- PDIP: plastic dual in-line package
- PLCC: plastic J-lead chip carrier
- TQFP: thin quad flat pack
- PQFP: plastic quad flat pack
- Contact Altera Applications for this information.
