| Table 1. Thermal Resistance of Excalibur Embedded Processor Solutions | |||||||
| Device | Pin Count | Package | qJC (C/W) |
qJA (C/W)Still Air | qJA (C/W)100 ft./min. | qJA (C/W)200 ft./min. | qJA (C/W)400 ft./min. |
|---|---|---|---|---|---|---|---|
| EPXA1 |
484
|
FineLine® BGA (FBGA) |
4.0 |
20.0 |
18.3 |
15.8 |
13.9 |
| 672 | Flip Chip FBGA (Cu lid) |
0.52 |
11.3 |
9.3 |
7.9 |
6.7 |
|
| 672 | Flip Chip FBGA (AlSiC lid) |
0.78 |
12.2 |
10.2 |
8.6 |
7.2 |
|
| EPXA4 | 672 | Flip Chip FBGA (Cu lid) |
0.21 |
10.8 |
8.8 |
7.3 |
6.2 |
| 672 | Flip Chip FBGA (AlSiC lid) |
0.31 |
11.6 |
9.6 |
7.9 |
6.6 |
|
| 1,020 | Flip Chip FBGA (Cu lid) |
0.21 |
9.9 |
7.9 |
6.5 |
5.4 |
|
| 1,020 | Flip Chip FBGA (AlSiC lid) |
0.32 |
10.4 |
8.5 |
6.9 |
5.7 |
|
| EPXA10 | 1,020 | Flip Chip FBGA (Cu lid) |
0.11 |
9.6 |
7.6 |
6.2 |
5.1 |
| 1,020 | Flip Chip FBGA (AlSiC lid) |
0.17 |
10.0 |
8.0 |
6.4 |
5.2 |
|
Thermal Resistance of Excalibur Devices
Table 1 provides qJA (junction-to-ambient thermal resistance) and qJC (junction-to-case thermal resistance) values for Altera® Excalibur devices.
