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主页 > 支持 > 器件 > 热阻 > Thermal Resistance of FLEX Devices 打印此页 发送此页 Thermal Resistance of FLEX Devices Tables 1 through 3 provide qJA (junction-to-ambient thermal resistance) and qJC (junction-to-case thermal resistance) values for Altera® FLEX® devices.  Table 1:  Thermal Resistance of FLEX 10K Devices Device Pin Count Package qJC (C/W) qJA (C/W)Still Air qJA (C/W)100 ft./min. qJA (C/W)200 ft./min. qJA (C/W)400 ft./min. EPF10K10 84 PLCC 9.0 28.0 26.0 24.0 22.0 144 TQFP 7.0 26.0 25.0 24.0 23.0 208 PQFP 5.0 29.0 27.0 25.0 20.0 EPF10K10A 100 TQFP 10.0 35.0 33.0 31.0 28.0 144 TQFP 7.0 29.0 28.0 26.0 25.0 208 PQFP 5.0 30.0 29.0 27.0 21.0 256 FineLine® BGA (FBGA) 7.0 33.0 30.0 28.0 26.0 EPF10K20 144 TQFP 6.0 24.0 23.0 22.0 21.0 208 RQFP 1.0 17.0 16.0 15.0 13.0 240 RQFP 1.0 14.0 12.0 11.0 10.0 EPF10K30 208 RQFP 1.0 17.0 16.0 15.0 12.0 240 RQFP 1.0 13.0 12.0 11.0 10.0 356 BGA 1.0 12.0 11.0 10.0 9.0 EPF10K30A 144 TQFP 7.0 25.0 24.0 23.0 22.0 208 PQFP 5.0 29.0 27.0 24.0 19.0 240 PQFP 4.0 25.0 22.0 20.0 17.0 256 FBGA 6.0 28.0 26.0 24.0 23.0 356 BGA 1.0 12.0 11.0 10.0 9.0 484 FBGA 5.0 24.0 22.0 21.0 20.0 EPF10K30E 144 TQFP 9.0 28.0 27.0 26.0 24.0 208 PQFP 5.0 30.0 28.0 26.0 21.0 256 FBGA 9.0 31.0 29.0 28.0 25.0 484 FBGA 6.0 26.0 25.0 24.0 22.0 EPF10K40 208 RQFP 1.0 17.0 16.0 15.0 12.0 240 RQFP 1.0 13.0 12.0 11.0 10.0 EPF10K50 240 RQFP 1.0 12.0 11.0 10.0 9.0 356 BGA 1.0 12.0 11.0 10.0 9.0 403 PGA 3.0 12.0 10.0 9.0 8.0 PGA (1) 3.0 10.0 8.0 7.0 6.0 EPF10K50V 240 RQFP 4.0 25.0 22.0 20.0 17.0 240 RQFP 1.0 13.0 12.0 11.0 10.0 356 BGA 1.0 12.0 11.0 10.0 9.0 484 FBGA 5.0 23.0 22.0 21.0 20.0 EPF10K50E 144 TQFP 9.0 26.0 25.0 24.0 23.0 208 PQFP 5.0 29.0 27.0 24.0 19.0 240 PQFP 4.0 25.0 22.0 20.0 17.0 256 FBGA 6.0 29.0 27.0 26.0 24.0 484 FBGA 5.0 25.0 24.0 23.0 21.0 EPF10K50S 144 TQFP 9.0 26.0 25.0 24.0 23.0 208 PQFP 5.0 29.0 28.0 25.0 20.0 240 PQFP 4.0 26.0 23.0 20.0 17.0 256 FBGA 7.0 30.0 28.0 27.0 24.0 356 BGA 1.0 12.0 11.0 10.0 9.0 484 FBGA 5.0 25.0 24.0 23.0 22.0 EPF10K70 240 RQFP 1.0 12.0 11.0 10.0 9.0 503 PGA 1.0 8.0 7.0 6.0 4.0 EPF10K100 503 PGA 1.0 8.0 7.0 6.0 4.0 PGA (1) 1.0 6.0 5.0 4.0 3.0 PGA (2) - 2.0 - - - EPF10K100A 240 RQFP 1.0 13.0 11.0 10.0 9.0 356 BGA 1.0 12.0 11.0 10.0 9.0 484 FBGA 5.0 22.0 21.0 20.0 18.0 600 BGA 0.5 10.0 9.0 8.0 7.0 EPF10K100E 208 PQFP 5.0 28.0 26.0 23.0 18.0 240 PQFP 4.0 23.0 21.0 19.0 16.0 256 FBGA 6.0 28.0 26.0 25.0 23.0 356 BGA 1.0 12.0 11.0 10.0 9.0 484 FBGA 5.0 24.0 23.0 22.0 21.0 EPF10K130V 599 PGA 1.0 8.0 7.0 6.0 4.0 600 BGA 0.5 10.0 9.0 8.0 7.0 EPF10K130E 240 PQFP 4.0 21.0 19.0 17.0 15.0 356 BGA 1.0 12.0 11.0 10.0 9.0 484 FBGA 5.0 23.0 22.0 21.0 20.0 600 BGA 0.5 10.0 9.0 8.0 7.0 672 FBGA 5.0 21.0 20.0 19.0 18.0 EPF10K200E 599 PGA 1.0 8.0 7.0 6.0 4.0 600 BGA 0.5 10.0 9.0 8.0 7.0 672 FBGA 5.0 20.0 19.0 18.0 17.0 EPF10K200S 240 RQFP 1.0 13.0 11.0 10.0 9.0 356 BGA 1.0 12.0 11.0 10.0 9.0 484 FBGA 5.0 22.0 21.0 20.0 19.0 600 BGA 0.5 10.0 9.0 8.0 7.0 672 FBGA 5.0 21.0 20.0 19.0 18.0 EPF10K250A 599 PGA 1.0 8.0 7.0 6.0 4.0 600 BGA 0.5 10.0 9.0 8.0 7.0 Notes: (1) Attached pin-fin heat sink. (2) Attached motor-driven fan heat sink.      Table 2:  Thermal Resistance of FLEX 8000 Devices Device Pin Count Package qJC (C/W) qJA (C/W)Still Air qJA (C/W)100 ft./min. qJA (C/W)200 ft./min. qJA (C/W)400 ft./min. EPF8282A 84 PLCC 10.0 30.0 28.0 26.0 23.0 100 TQFP 11.0 36.0 34.0 32.0 29.0 EPF8452A 84 PLCC 10.0 30.0 28.0 26.0 23.0 100 TQFP 11.0 35.0 33.0 31.0 28.0 160 PQFP 6.0 32.0 31.0 30.0 28.0 160 PGA 6.0 20.0 13.0 10.0 8.0 EPF8636A 84 PLCC 10.0 29.0 28.0 26.0 23.0 160 PQFP 6.0 32.0 31.0 30.0 27.0 192 PGA 6.0 16.0 11.0 8.0 6.0 208 PQFP 5.0 30.0 38.0 26.0 20.0 208 RQFP 1.0 17.0 16.0 15.0 14.0 EPF8820A 144 TQFP 9.0 26.0 25.0 24.0 23.0 160 PQFP 6.0 32.0 31.0 30.0 27.0 192 PGA 6.0 16.0 11.0 8.0 6.0 208 PQFP 5.0 29.0 27.0 25.0 20.0 208 RQFP 1.0 17.0 16.0 15.0 14.0 225 BGA 6.0 28.0 19.0 14.0 11.0 EPF81188A 208 PQFP 5.0 28.0 26.0 24.0 19.0 232 PGA 2.0 14.0 10.0 7.0 5.0 240 PQFP 4.0 24.0 21.0 19.0 16.0 240 RQFP 1.0 14.0 12.0 11.0 10.0 EPF81500A 240 PQFP 4.0 22.0 20.0 19.0 16.0 240 RQFP 1.0 13.0 12.0 11.0 10.0 280 PGA 2.0 14.0 10.0 7.0 5.0 304 RQFP 1.0 11.0 10.0 9.0 8.0   Table 3:  Thermal Resistance of FLEX 6000 Devices Device Pin Count Package qJC (C/W) qJA (C/W)Still Air qJA (C/W)100 ft./min. qJA (C/W)200 ft./min. qJA (C/W)400 ft./min. EPF6010A 100 TQFP 11.0 35.0 33.0 31.0 28.0 144 TQFP 10.0 28.0 26.0 25.0 24.0 EPF6016 144 TQFP 10.0 28.0 26.0 25.0 24.0 208 PQFP 5.0 30.0 28.0 26.0 21.0 240 PQFP 4.0 26.0 24.0 21.0 17.0 256 BGA 6.0 28.0 22.0 20.0 19.0 EPF6016A 100 TQFP 11.0 35.0 33.0 31.0 28.0 FBGA 14.0 36.0 34.0 32.0 29.0 144 TQFP 10.0 29.0 28.0 26.0 24.0 208 PQFP 5.0 30.0 29.0 26.0 21.0 256 F 10.0 32.0 30.0 29.0 26.0 EPF6024A 144 TQFP 10.0 27.0 26.0 25.0 24.0 208 PQFP 5.0 29.0 28.0 26.0 20.0 240 PQFP 4.0 26.0 23.0 21.0 17.0 256 BGA 6.0 28.0 22.0 20.0 19.0 FBGA 8.0 30.0 29.0 27.0 25.0 给本页评分

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