| Table 1. Thermal Resistance of Mercury Devices | |||||||
| Device | Pin Count | Package | qJC (C/W) |
qJA (C/W)Still Air | qJA (C/W)100 ft./min. | qJA (C/W)200 ft./min. | qJA (C/W)400 ft./min. |
|---|---|---|---|---|---|---|---|
| EP1M120 | 484 | FineLine® BGA (FBGA) (Cu lid) |
0.58 |
12.2 |
10.1 |
8.7 |
7.5 |
| FBGA (AlSiC lid) |
0.87 |
13.0 |
11.1 |
9.3 |
7.9 |
||
| EP1M350 | 780 | FBGA (Cu lid) |
0.22 |
10.5 |
8.5 |
7.1 |
5.9 |
| FBGA (AlSiC lid) |
0.34 |
11.0 |
9.2 |
7.6 |
6.3 |
||
Thermal Resistance of Mercury Devices
Table 1 provides qJA (junction-to-ambient thermal resistance) and qJC (junction-to-case thermal resistance) values for Altera® Mercury® devices.
