器件
      Arria GX
      Stratix III
      Stratix II
   Stratix II GX
      Cyclone III
      Cyclone II
      Stratix GX
  
 基本原理
      信号完整性基础
      高速术语表
  
 技术
      即插即用信号完整性
  
 信号完整性合作伙伴
      设计服务
  
 SI专家学习指导
      介绍Bogatin博士
      每月专栏
  

Cyclone III FPGA Signal Integrity Center

Cyclone® III 65-nm FPGAs offer best-in-class signal integrity to reduce the risk of system failures, simplify the design process, and enhance design performance and flexibility.  Table 1 shows the Cyclone III enhancements for signal integrity.

Signal Integrity

Table 1. Cyclone  III FPGA Enhancements for Signal Integrity
Enhancement Benefit
12:1:1 User I/O, Ground, and Power Ratio Provides low impedance return path for every I/O to reduce loop inductance and noise.
Adjustable Slew Rate Control Controls signal edge rate to reduce noise.
On-Chip Termination Eliminates the need for external termination resistors to lower system cost and simplify printed circuit board (PCB) design.
On-Die Decoupling Provides high-frequency decoupling and suppresses power noise. Reduces the number of external PCB decoupling capacitors to lower system cost and simplify PCB design.

12:1:1 User I/O, Ground, and Power Ratio

The Cyclone III package designs reduce noise while providing the optimum number of user I/O pins. Cyclone III pin-outs provide low impedance return path for every single I/O and, therefore, reduce VCC sag and ground bounce.

Adjustable Slew Rate Control

Cyclone III FPGAs offer adjustable slew rate control, allowing you to change the signal edge rate for better signal integrity. You can use three different settings to match the desired I/O standard and control noise and overshoot. This flexibility allows you to have better control over the design to achieve optimum system performance and excellent signal integrity.

On-Chip Termination

Cyclone III FPGAs offer series on-chip termination (OCT) technology on all I/O pins to further improve signal integrity performance and eliminate the need for external termination resistors. This technology lowers system cost and simplifies PCB design.

On-Die Decoupling

On-die decoupling capacitors provide high-frequency decoupling that external PCB decoupling capacitors and voltage regulator modules cannot support. These low-inductance capacitors suppress power noise for excellent signal integrity performance.

These decoupling capacitors also reduce the number of external PCB decoupling capacitors, saving precious board space, reducing cost, and greatly simplifying PCB design.

This page contains links to Cyclone III FPGA resources that will help you develop, layout, and verify your high-speed design.

IBIS and SPICE Models

Correlated Cyclone III I/O SPICE and IBIS models will be available shortly.

  • IBIS Models
  • SPICE Models
    • NDA required; contact your local Altera® sales representative for details

Documentation

 
Memory Solutions Center

Cyclone III Home Page

   
注册索取最新邮件通知

  请填写反馈意见
  注册索取最新邮件通知